Successful application to drilling of silicon wafers, quartz, and alumina.
In response to strong demand for drilling jobs involving wafers and other ceramics, etc., KYOWA has developed this new PCD multi-angle drill series specifically designed for machining hard brittle materials, by leveraging its wealth of know-how on PCD tool machining built up over the years.
As the tools used to machine hard brittle materials must be highly abrasion-resistant, sintered-diamond PCD is used instead of coated carbide to manufacture these drills.
In addition, the tool tips are shaped with multiple angles to disperse and reduce the cutting resistance, so they can execute machining with high efficiency and precision.
The PCD multi-angle drills that are now commercially released are designed for drilling hard brittle materials, and allow users to achieve significantly higher machining precision and efficiency.
Work size: 50 mm×50 mm
Drilling 900 holes
Tool used: PCD multi-angle drill φ0.45
Workpiece material: SiO₂
Coolant: water-soluble cutting fluid
| Cutting conditions: | |
| Tool diameter (mm) | φ0.45 |
| Rotation speed (rpm) | 15,000 |
| Feed (mm/rev) | 0.0007 |
| Machining depth (mm) | 4.0 |
| Step feed (mm) | 0.2 |
| No. of holes | 900 |
