Brittle material processing
Processing of monocrystalline silicon
Workpiece to be processed
Enlarged image of hole
2,742 holes processed
Work Details
Monocrystalline silicon φ100 x t10
Machine used
Sodick JF500L
Processing content
Drilling Hole diameter 0.75 mm, depth 7 mm, number of holes 2,742 *Has experience up to 8,000 holes
Use of tools
Special PCD Drills
Cutting conditions
| Revolution (min-1) | Feed (㎜/rev) | Step (mm) | Cutting oil | Machining Time (Hours) |
|---|---|---|---|---|
| 13,000 | 0.0007 | 0.3 | Water soluble | 75 |
POINT
This drill is specially designed for high-brittle materials with a multi-stage angle at the tool tip.
The cutting resistance is radially The cutting resistance is radially dispersed and high hole quality can be obtained.
The cutting resistance is distributed in the radial direction and high hole quality can be obtained.