Brittle material processing
硬脆材加工
Processing of monocrystalline silicon
単結晶シリコンの加工
加工ワーク
Workpiece to be processed
穴拡大画像
Enlarged image of hole
2,742穴加工後
2,742 holes processed
Work Details
ワーク詳細
単結晶シリコン φ100 x t10
Monocrystalline silicon φ100 x t10
Machine used
使用機械
Sodick JF500L
Processing content
加工内容
穴あけ ／ 穴径φ0.75、深さ7㎜、穴数2,742 ※8,000穴まで実績有り
Drilling Hole diameter 0.75 mm, depth 7 mm, number of holes 2,742 *Has experience up to 8,000 holes
Use of tools
使用工具
特殊PCDドリル φ0.75
Special PCD Drills
Cutting conditions
切削条件
| 回転数 (min-1) Revolution | 送り (㎜/rev) Feed | ステップ (mm) Step | 切削油 Cutting oil | 加工時間 (Hours) Machining Time |
|---|---|---|---|---|
| 13,000 | 0.0007 | 0.3 | 水溶性 Water soluble | 75 |
POINT
工具先端が多段角で構成された高脆材専用のドリルであり切削抵抗を半径方向に分散させ、高い穴品位が得られる形状。
This drill is specially designed for high-brittle materials with a multi-stage angle at the tool tip.
The cutting resistance is radially The cutting resistance is radially dispersed and high hole quality can be obtained.
The cutting resistance is distributed in the radial direction and high hole quality can be obtained.